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  2. Richard Hartley reading list | Azitech ApS
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The book is heavily and clearly illustrated. CONTENTS: EMI: Overview and Scope; classes of EMI; radiated emissions; conducted emissions ;susceptibility; radio frequency interference; electrostatic discharge; differential and common-mode noise; standards; safety and testing; ferrite bead primer; pulse signal analysis; accidental antennas in digital systems; transmission lines and radiation resistance; grounding; PCB ground planes; augmented ground planes; daughterboard grounding; clock-frequency architecture; power supplies; switching power supplies; battery-operated products; enclosures; circuit board layering; PCB construction details; segmentation and component placement; power distribution; IC decoupling; termination techniques; non-video port filtration; video port filtration; project management; department management; full appendices.

Kenneth Keenan. Description Based on over twenty years of hands-on experience with electromagnetic interference EMI , Digital Design for Interference Specifications provides circuit designers concrete rules that can be applied immediately to the design of new digital products. Lexington, KY: Lexmark International, Ficchi, Rocco. New York: Hayden, , pp. Ficchi, Rocco F.

Fink, Donald G. Fish, Peter J. Fluke, John C. New York: Van Nostrand Reinhold, , pp.

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CrossRef Google Scholar. Freeman, Ernest R. Gabrielson, Bruce C. Giacoletto, L. Gibilisco, Stan, Electronics Portable Handbook. Ginsberg, Gerald L. Goedblood, Jasper, Electromagnetic Compatibility. New York: Prentice Hall, , pp.

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  • digital design for interference specifications a practical handbook for emi suppression Manual.

Gore, Gregory V. Graf, Rudolf F. Hall, Stephen H. Reston, VA: Reston Publishing, , pp. Harper, Charles A. Hemming, Leland H. Hughes, Frank P. Hutchinson, Charles L. Jessop, G. Johnson, Alan K. Jordan, Edward C.

Richard Hartley reading list | Azitech ApS

Kaufman, Milton, and Seidman, Arthur H. Keenan, R. Kenneth, Digital Design for Interference Specifications. Norwood, MA: Artech House, , pp.

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Kimmel, William D. Kodali, V. Korn, Granino A. Landee, Robert W. Lenk, John D. Mardiguian, Michel, and White, Donald R.

Bibliography of EMC Publications

Mazda, F. Boston, MA: Butterworths, , pp. Mills, Jeffrey P.

Montrose, Mark I. Also, it is common to group the signal transmission wires separate from the power conductors. As more fully explained in Chapter 13 , there are both balanced and unbalanced electrical transmission schemes, and the system determines this requirement. Typical balanced lines are twisted pairs, and unbalanced lines are coaxial. Single-Mode — Dispersion shifted. The system requirements determine the optical fiber type. Some parameters to consider in any type fiber optic are as follows:. The optical fibers can have either an individual buffer on each fiber optic, or they can have a common housing for all the optical fibers.

The user will need to weigh the trade-off with the different approaches for the specific application because there is no single design that is correct for all applications.


Several standard cable design specification sheets follow throughout this section and are representative of state-of-the-art cables provided to the offshore industry by Falmat. A successful innovator in the ROV cable industry, they have been designing, manufacturing, and testing such cables for over 25 years. The network-on-chip NoC design paradigm is seen as a way of enabling the integration of an exceedingly high number of computational and storage blocks in a single chip. Although a complex SoC can be viewed as a micronetwork of multiple stand-alone blocks, models and techniques from networking, multiple-agent concurrency and parallel processing can be borrowed for the networking-oriented applications of multicore processors.

It must do this under the limitation of intrinsically unreliable signal transmission media. Such limitations are due to the increased likelihood of timing and data errors, the variability of process parameters, crosstalk, and environmental factors such as electromagnetic interference and software errors. To improve network-traffic performance, processor vendors have integrated multiple proprietary cores with integrated memory subsystems, called network processors. However, porting general-purpose processor software required for network services to a proprietary core with a limited amount of code space and proprietary development tools has relegated network processors to Layer 2 and Layer 3 types of network traffic processing.

Adding further disarray to the above gap between communication processors and network processors is the fact that both processors fail to address the need for processing computationally intensive operations and network-services applications, such as encryption, transmission control protocol TCP offload, big volumes of data compression and decompression, look-ups, and regular-expression acceleration. This necessitates attaching separate coprocessors connected via additional system interfaces. Figure 5.

Fillers such as carbon and metal powders have been used to enhance both the electrical and the thermal conductivity of otherwise insulating polymers. Then, at the percolation threshold, when conductive paths are formed, the conductivity rises sharply. Above the percolation threshold the conductivity rises more slowly. The conduction process, involving interparticle tunnelling, has been extensively investigated. Because of its low cost and availability, carbon black has been extensively used. Despite this, much work is still being done to relate particle size, structure, aggregation, surface contamination, loading and interaction of filler and polymer matrix to composite conductivity.

Aggregation has significant effects on conductivity, particularly when it produces elongated particles, since the percolation threshold for needles occurs at a considerably lower loading than for spherical particles. Aggregation is affected by the compounding process and period, and the great variety of structure of carbon blacks means that process parameters must be optimized in each case.

Melt viscosity and surface tension strongly affect conductivity, as do polymer crystallinity and degree of crosslinking. More troublesome is the tendency of carbon to adsorb moisture and other volatile contaminants, and this has resulted in the use of other fillers. Figure 7. Conductivity vs. Sumita, H. Abe, H.